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Researchers at MIT have come up with a new approach to Micro-electro-mechanical systems (MEMS) design that enables engineers to design 3D configurations, using existing fabrication processes. Researchers built a MEMS device that enables 3D sensing on a single chip. The silicon device, not much larger than Abraham Lincoln’s ear on a U.S. penny, contains microscopic elements about the width of a red blood cell that can be engineered to reach heights of hundreds of microns above the chip’s surface. One of the main driving factors in the current MEMS industry is to try to make fully three-dimensional devices on a single chip, which would not only enable real 3D sensing and actuation, but also yield significant cost benefits.
Read More: [MIT]
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